类别:英语 / 日期:2026-02-11 / 浏览:0 / 评论:0

CMP

  • abbr.Command Module Pilot 指挥舱驾驶员;Computed Maximum Pressure 计算的最大压力;Corrugated Metal Pipe 波纹金属管
  • 网络解释.冠军;共中心点;金属波纹管;凸轮轴转角传感器

    CMP

    1 . The CMP process is also used to control film thickness and removal of barrier layers.
    CMP技术也用于控制薄膜厚度及剥离隔离层.

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    2 . The copper chemical - mechanical polishing ( CMP ) which is the key planarization technology for ULSI manufacturing was discussed.
    对用于甚大规模集成电路(ULSI) 制造的关键平坦化工艺———铜化学机械抛光 ( CMP) 技术进行了讨论.

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    3 . Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
    为模拟cmp磨料 分配系统的粒子减少开发了数字模型.

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    4 . Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
    最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.

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